The SiC Power Center, Enterprise Europe Network and Yole Développement are pleased to announce for the 3rd time, their collaboration on the International SiC Power Electronics Applications Workshop.
From June 9 to 11, international experts will meet in Stockholm to share their expertise, recent developments and vision of SiC electronics applications. More than an overview on SiC industry, ISiCPEAW proposes a focus on power electronics applications.
In 2012, the workshop attracted more than 200 attendees from all around the world, and we expect no less in 2013.
The overall aim of the workshop is to promote the use of the latest silicon carbide research and development results, by bringing together the foremost experts from both academia and industry. The focus lies on the use of SiC technology in power electronics applications, components, modules, packaging, reliability and benchmarking versus silicon power electronics. The program is defined by SiC experts and reflects the status of SiC from an industry point of view. Specialists from all over the world will present their views on current status, ongoing development and the opportunities of applications in the power electronic area. They will also present the latest products and solutions, and will be available for detailed technical discussions.
Exhibition & B2B Matchmaking
More than just a conference, the ISiCPEAW event includes debates and numerous networking opportunities throughout the entire workshop. An exhibition area dedicated to the experts of the SiC industry is set up by Yole Développement and a business to business matchmaking is arranged by Enterprise Europe Network.
The matchmaking is a platform for discussion and exchange between research, product development and application. All participants will have the opportunity to book One-on-One meetings. This is a quick and easy way to meet with potential cooperation partners.
The tutorial will take place on the KTH Campus, Teknikringen 33, in central Stockholm on the 9th of June, preceding the two day workshop. The course will cover the subjects of SiC device design and operation, packaging technology and system application and device driver issues.
Conference and tutorial language will be English.
There are three different fees, depending on your participation.
The workshop and matchmaking includes B2B meetings, coffee breaks, two lunches and one dinner.
The tutorial fee includes course material, coffee breaks, and lunch.
Fees exclude 25 % VAT.
Payment is easy through Paypal with your credit card. You may also pay by regular bank transfer due to the invoice generated when you register. You find the invoice when you log in to your personal profile.
1. Tutorial (student): SEK 900,00 + VAT
2. Tutorial (non student): SEK 1800,00 + VAT
3. Workshop and matchmaking: SEK 3000,00 + VAT
You may also pay by regular bank transfer due to the invoice generated when you register. You find the invoice when you log in to your personal profile.
Dates for your agenda